Separation apparatus, separation system, and separation method
AssigneeTokyo Electron Limited
InventorsMasaru HONDA, Takashi SAKAUE
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AssigneeTokyo Electron Limited
InventorsMasaru HONDA, Takashi SAKAUE
Estimating the term…
A separation apparatus is configured to separate a combined substrate, in which a first substrate and a second substrate are bonded, into the first substrate and the second substrate. The separation apparatus includes a first holder configured to hold the first substrate of the combined substrate; a second holder configured to hold the second substrate of the combined substrate; a separation guide configured to be advanced between the first substrate and the second substrate of the combined substrate to form a separation start portion where separation begins; and a gas ejector configured to eject a gas between the first substrate and the second substrate of the combined substrate. The gas ejector changes at least one of an ejection position, an ejection direction, or an ejection amount as an ejection state of the gas after the separation start portion is formed by the separation guide and the gas is ejected.
A separation apparatus configured to separate a combined substrate, in which a first substrate and a second substrate are bonded, into the first substrate and the second substrate, the separation apparatus comprising:
A separation system, comprising:
A separation method of separating a combined substrate, in which a first substrate and a second substrate are bonded, into the first substrate and the second substrate, the separation method comprising:
Dependencies are inferred from the claim text.