H10P 72/7442
Separation by peeling
Official title: {Separation by peeling}
H10P72/7442 (Separation by peeling) appears on 570 US grants and 784 published applications in this corpus.
Search patents in H10P- Granted patents
- 570
- Published applications
- 784
- Assignees
- 230
- Inventors
- 1,320
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 3 |
| 2002 | 1 | 7 |
| 2003 | 5 | 11 |
| 2004 | 5 | 6 |
| 2005 | 5 | 10 |
| 2006 | 5 | 12 |
| 2007 | 8 | 14 |
| 2008 | 6 | 11 |
| 2009 | 5 | 10 |
| 2010 | 14 | 14 |
| 2011 | 9 | 23 |
| 2012 | 7 | 36 |
| 2013 | 17 | 32 |
| 2014 | 22 | 31 |
| 2015 | 39 | 47 |
| 2016 | 40 | 60 |
| 2017 | 44 | 55 |
| 2018 | 47 | 55 |
| 2019 | 57 | 38 |
| 2020 | 41 | 53 |
| 2021 | 46 | 46 |
| 2022 | 34 | 51 |
| 2023 | 24 | 45 |
| 2024 | 25 | 41 |
| 2025 | 29 | 36 |
| 2026 | 27 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Laminate and release agent composition28 Jul 2026US 12,696,726 B2Nissan Chemical Corporation
- Semiconductor device production method21 Jul 2026US 12,690,420 B2Tokyo Ohka Kogyo.Co., Ltd.
- Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure14 Jul 2026US 12,685,089 B2Resonac Corporation
- Adhesive composition and method of manufacturing a semiconductor device using the same30 Jun 2026US 12,668,726 B2Samsung Electronics Co., Ltd.
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
- Device and method for manufacturing display panel, and method of manufacturing electronic device including display panel1 Oct 2026US 2026/0305228 A1Samsung Display Co., Ltd.
- Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device24 Sep 2026US 2026/0293602 A1Kioxia Corporation
- Mounter device, tape removal device, substrate transfer apparatus, tape removal method, and substrate transfer method17 Sep 2026US 2026/0282836 A1Teikoku Taping System Co., Ltd.
- Method for fabricating interposer, method for fabricating chip, interposer, chip and chip package17 Sep 2026US 2026/0282940 A1Beijing Huafeng Integrated Electronics Co., LTD.
Most cited
By later US patents
- Vehicle, display device and manufacturing method for a semiconductor device423US 7,335,573 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays342US 8,865,489 B2The Board of Trustees of the University of Illinois · 2014
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate95US 8,008,121 B2STATS ChipPAC, Ltd. · 2011
- Semiconductor device and method of bonding different size semiconductor die at the wafer level71US 8,993,377 B2STATS ChipPAC, Ltd. · 2015