Method for fabricating interposer, method for fabricating chip, interposer, chip and chip package

A method for preparing a chip, comprising:

• S71, providing a second substrate and an organic connection bridge, each internally provided with redistribution wires and externally with connection points;
• S72, placing the organic connection bridge on a surface of the second substrate;
• S73, fixing at least two bare dies on the second substrate, wherein pins of each bare die are connected to the connection points on both the second substrate and the organic connection bridge;
• and
• S74, protecting the connections between the bare dies and the connection bridge;
• for Step S71, providing the organic connection bridge comprises:
• S721, providing a second carrier, wherein the second carrier comprises a third portion and a fourth portion, the third portion being the outer edge of one side of the second carrier, and the fourth portion being a plane of the side defined by the outer edge;
• S722, adding a second release adhesive to the third portion, adding a second metal film to the fourth portion, and curing the second release adhesive;
• S723, adding a second dielectric layer on a surface of the second metal film;
• S724, preparing a second redistribution layer on the second dielectric layer;
• S725, removing the current third portion, wherein the current third portion at least comprises the second release adhesive attached thereon;
• and
• S726, peeling off the current fourth portion without high pressure and stress, and cutting to form the organic connection bridge.

A chip, comprising:

• a second substrate and an organic connection bridge arranged on a surface of the second substrate, wherein each of the second substrate and the organic connection bridge is internally provided with redistribution wires;
• and
• at least two bare dies fixed on the surface of the second substrate, wherein pins of each bare die are connected to connection points on both the second substrate and the organic connection bridge;
• and
• a method for preparing the organic connection bridge comprises:
• S721, providing a second carrier, wherein the second carrier comprises a third portion and a fourth portion, the third portion being the outer edge of one side of the carrier, and the fourth portion being a plane of the side defined by the outer edge;
• S722, adding a second release adhesive to the third portion, adding a second metal film to the fourth portion, and curing the second release adhesive;
• S723, adding a second dielectric layer on a surface of the second metal film;
• S724, preparing a second redistribution layer on the second dielectric layer;
• S725, removing the current third portion, wherein the current third portion at least comprises the second release adhesive attached thereon;
• and
• S726, peeling off the current fourth portion without high pressure and stress, and cutting to form the organic connection bridge.