Laminate and release agent composition
AssigneeNissan Chemical Corporation
InventorsTakahisa Okuno, Yuki Usui, Hiroto Ogata, Shunsuke Moriya, Masaki Yanai, Tetsuya Shinjo
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Abstract
The laminate of the invention has a semiconductor substrate, a support substrate, a release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, characterized in that the release layer is a film formed from a releasing agent composition containing a polyorganosiloxane component essentially containing polydimethylsiloxane; the polyorganosiloxane component has a viscosity of 5.50×103 Pa·s to 0.75×103 Pa·s, as measured at 25° C.; and the film has a thickness of 0.01 μm to 4.90 μm.
Claims18
A laminate comprising
- a semiconductor substrate,
- a support substrate,
- a release layer disposed so as to come into contact with the semiconductor substrate, and
- an adhesive layer disposed between the support substrate and the release layer, wherein:
- the release layer is a thermoplastic film formed from a releasing agent composition containing a polyorganosiloxane component comprising polydimethylsiloxane represented by formula (X):
- where nm is a positive integer and represents the number of repeating units;
- the polyorganosiloxane component has a viscosity of 5.50×103 Pa·s to 0.75×103 Pa·s, as measured at 25° C.;
- and
- the film has a thickness of 0.01 μm to 4.90 μm.
A releasing agent composition for forming a release layer included in a laminate, the laminate comprising a semiconductor substrate, a support substrate, the release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, and the release layer being a thermoplastic film having a thickness of 0.01 μm to 4.90 μm, wherein the composition contains a polyorganosiloxane component comprising polydimethylsiloxane represented by formula (X):
- where nm is a positive integer and represents the number of repeating units, and the polyorganosiloxane component has a viscosity of 5.50×103 Pa·s to 0.75×103 Pa·s, as measured at 25° C.
Dependencies are inferred from the claim text.