H10P 72/7444
Using a peeling wedge, a knife or a bar
Official title: {using a peeling wedge, a knife or a bar}
H10P72/7444 (Using a peeling wedge, a knife or a bar) appears on 77 US grants and 107 published applications in this corpus.
Search patents in H10P- Granted patents
- 77
- Published applications
- 107
- Assignees
- 54
- Inventors
- 163
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 3 |
| 2002 | 1 | 4 |
| 2003 | 4 | 5 |
| 2004 | 1 | 3 |
| 2005 | 2 | 8 |
| 2006 | 3 | 7 |
| 2007 | 6 | 6 |
| 2008 | 4 | 4 |
| 2009 | 4 | 2 |
| 2010 | 4 | 4 |
| 2011 | 3 | 2 |
| 2012 | 0 | 7 |
| 2013 | 3 | 9 |
| 2014 | 5 | 2 |
| 2015 | 9 | 6 |
| 2016 | 4 | 5 |
| 2017 | 4 | 1 |
| 2018 | 1 | 1 |
| 2019 | 3 | 1 |
| 2020 | 2 | 5 |
| 2021 | 4 | 4 |
| 2022 | 3 | 1 |
| 2023 | 1 | 6 |
| 2024 | 1 | 2 |
| 2025 | 2 | 5 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Laminate and release agent composition28 Jul 2026US 12,696,726 B2Nissan Chemical Corporation
- Semiconductor chip delamination device and control method therefor30 Sep 2025US 12,431,371 B2Doosan Tesna Inc.
- Hybrid bond method for fixing dies3 Jun 2025US 12,322,639 B2
- Method of transferring device layer to transfer substrate and highly thermal conductive substrate16 Jan 2024US 11,876,014 B2Shin-Etsu Chemical Co., Ltd.
- Workpiece unit3 Jan 2023US 11,545,386 B2Disco Corporation
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Protective tape peeling apparatus and protective tape peeling method23 Apr 2026US 2026/0114221 A1Samsung Electronics Co., Ltd.
- Manufacturing technique for mechanical debonding of a temporary carrier wafer in a stacked semiconductor system29 Jan 2026US 2026/0033288 A1Micron Technology, Inc.
- Circuit board manufacturing method15 Jan 2026US 2026/0020148 A1Mitsui Mining & Smelting Co., Ltd.
- Chips direct bonding method25 Dec 2025US 2025/0391698 A1Commissariat à I' énergie atomique et aux énergies alternatives
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Metal and electronically conductive polymer transfer69US 7,410,825 B2Eastman Kodak Company · 2008
- Wafer transfer apparatus36US 6,238,515 B1Kabushiki Kaisha Toshiba · 2001
- Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements33US 6,297,075 B1Hitachi, Ltd. · 2001
- Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer33US 7,060,593 B2Kabushiki Kaisha Toshiba · 2006