Circuit board manufacturing method

Abstract

A method for manufacturing a wiring substrate includes: providing a laminated sheet that includes a release layer and a wiring layer in order on a carrier; forming a step or gap between the wiring layer and the carrier as a release starting portion; inserting a rigid plate having a long portion to the release starting portion from the long portion, wherein the long portion is longer than a width of the laminated sheet; and moving the rigid plate from the release starting portion along the release layer, thereby developing release of the wiring layer from the carrier, wherein the wiring layer has a flexural modulus at 25° C. measured in accordance with JIS K6911-1995 of 0.3 GPa or more and 300 GPa or less.

Dependencies are inferred from the claim text.