Protective tape peeling apparatus and protective tape peeling method

A protective tape peeling apparatus, comprising:

• a support table configured to support wafers that are sequentially placed and to which respective protective tapes are attached on the wafers;
• a tape peeling portion including a roller holder having an upper pinch roller and a lower pinch roller configured to move a protective tape peeled from a previous wafer in a first direction, a first attachment portion configured to attach one end portion of the protective tape moving between the upper pinch roller and the lower pinch roller to one end portion of a first protective tape attached to a first wafer on the support table, and a second attachment portion configured to attach one end portion of the first protective tape peeled from the first wafer and moving between the upper pinch roller and the lower pinch roller to one end portion of a second protective tape attached to a second wafer on the support table;
• a reversing guide configured to reverse one end portion of the first protective tape peeled off from the first wafer such that a non-adhesive surface of one end portion of the first protective tape faces the support table;
• a first driving portion configured to reciprocally move the tape peeling portion between a first position on a first side of the support table and a second position on a second side of the support table, the second side of the support table being opposite the first side of the support table;
• and
• a second driving portion configured to move the reversing guide upward and downward on the second side of the support table.