Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements

A separating method of semiconductor elements comprising:

• a separation step for holding on a chuck a group of semiconductor elements, by positioning an object being stuck on an adhesive sheet which is fixed on a frame at periphery thereof, under condition of a semiconductor wafer and being cut into a unit of a semiconductor element under the condition of a semiconductor wafer, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held under the condition of a semiconductor wafer;
• and
• a storing step for storing into a tray, for picking up the semiconductor elements by a desired unit thereof from the group of semiconductor elements being stripped with the adhesive sheet in said separation step and held on the chuck, so as to be stored into a tray.

A separating method of semiconductor elements comprising:

• a separation step for holding on a chuck a group of semiconductor elements as an object, being stuck on an adhesive sheet under condition of a semiconductor wafer and cut out into a unit of the semiconductor element under the condition of a semiconductor wafer, and for striping said adhesive sheet from the group of semiconductor elements under the condition of a semiconductor wafer;
• and
• a pickup step for picking up the semiconductor element independently from the group of semiconductor elements being stripped with the adhesive sheet therefrom in said separating step and being held on the chuck.

A separating method of semiconductor elements comprising:

• a separation step for holding on a chuck a group of semiconductor elements, by positioning an object being stuck on an adhesive sheet which is fixed on a frame at periphery thereof, under condition of a semiconductor wafer and being cut out into a unit of a semiconductor element under the condition of a semiconductor wafer, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held under the condition of a semiconductor wafer;
• and
• a pickup step of picking up the semiconductor element independently from the group of semiconductor elements being stripped with the adhesive sheet therefrom in said separating step and being held on the chuck.