Hybrid bond method for fixing dies

A hybrid die bonding method, comprising the following steps of:

• dicing a wafer into a plurality of dies, the dies being distributed on a plurality of target blocks of a carrier film, each die having a first surface on a top and a second surface on a bottom attached to the carrier film with no solder or bump on the first and second surfaces;
• removing particles on the first surfaces of the plurality of dies;
• peeling off side portions and corner portions of the second surfaces of the dies away from the target blocks of the carrier film with remaining portions of the second surfaces of the dies still attached to the carrier film;
• turning over the carrier film, and transferring the plurality of dies to a first carrier with the first surfaces of the dies contacting the first carrier;
• removing the carrier film from the second surfaces of the dies;
• cleaning particles on the second surfaces of the dies;
• and
• transferring the dies from the first carrier to a substrate, the substrate having no solder or bump on surfaces;
• wherein the step of dicing the wafer into a plurality of dies further includes dicing the wafer into a plurality of rows of the dies, the plurality of rows of the dies being distributed on a plurality of corresponding rows of the target blocks of the carrier film;
• and the step of peeling off the side portions and the corner portions of the second surfaces of the dies away from the target blocks further includes the steps of:
• performing a peeling off process on two adjacent rows of the dies by pressuring connecting areas between two adjacent corresponding rows of the target blocks upward or downward so that the side portions and the corner portions of the second surfaces of the two adjacent rows of the dies are peeled off away from the carrier film but the remaining portions of the second surfaces of the two adjacent rows of the dies are still attached to the carrier film;
• and
• continuing to perform the peeling off process on another two adjacent rows of the dies until the peeling off process is completed for all rows of the dies.