Method for producing wiring board

Abstract

Provided is a method for manufacturing a wiring board in which unintentional release of a carrier during downsizing is suppressed and a first substrate can be reliably laminated onto a second substrate. This method for manufacturing a wiring board includes: providing a laminated sheet including a carrier, a release layer, and a metal layer, wherein the carrier has a flat region and an uneven region on at least a surface on the metal layer side, and wherein the uneven region is provided in a pattern surrounding the flat region; forming a resin-containing layer on a surface of the metal layer to obtain a carrier-attached first substrate; cutting the carrier-attached first substrate according to the pattern of the uneven region to obtain an individualized carrier-attached first substrate; and laminating the individualized carrier-attached first substrate onto a second substrate so that the carrier is on the outside, to obtain a composite substrate.

Dependencies are inferred from the claim text.