Semiconductor chip delamination device and control method therefor

A method of controlling a semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, the method including:

• a provision step (S1) of providing a semiconductor chip delamination device (10), the semiconductor chip delamination device (10) including:
• a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon;
• a delamination feeding unit (300) configured to feed a delamination seal contactable with the protective film so as to peel off the protective film from the semiconductor chip;
• a covering unit (500, 600) configured to allow the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film;
• and
• a delaminating unit (700) configured to peel off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof;
• wherein the stage unit (400) includes:
• a stage plate (420) configured to allow the ring frame to be seated thereon;
• a stage base (410) configured to allow the stage plate (420) to be seated thereon;
• a stage base shaft (430) configured to rotate the stage plate (420);
• and
• a stage base lifter (440) seatingly connected at one end to the stage base (420) to lift stage plate (420);
• a sensing unit (50) configured to detect the operation state of the stage unit (400), the delamination feeding unit (300), the covering unit (500, 600), and the delaminating unit (700), and the state of the delamination seal;
• and
• a control unit (20) configured to apply a control signal to the stage unit (400), the delamination feeding unit (300), the covering unit (500, 600), and the delaminating unit (700) based on a sensing signal from the sensing unit (50) and preset data stored in a storage unit;
• a stage seating step (S10) of allowing the ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated on the stage unit (400);
• a covering step (S20) of allowing the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film;
• and
• a delaminating step (S30) of peeling off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof.