Semiconductor device production method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsYubun Kikuchi, Yoshihiro Yamada, Ryuma Mizusawa
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Abstract
A method for efficiently producing circuit patterns (semiconductor devices) that allows for effortless pickup of circuit patterns after dicing. The method includes producing a semiconductor substrate with circuit patterns formed on a first surface; forming a first laminate by bonding a first support through a first adhesive layer to the first surface; forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface; debonding the first support from the second laminate; and picking up the circuit patterns from the second support.
Claims13
A semiconductor device production method comprising:
- producing a semiconductor substrate with circuit patterns formed on a first surface;
- forming a first laminate by bonding a first support through a first adhesive layer to the first surface;
- forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface;
- debonding the first support from the second laminate;
- and
- picking up the circuit patterns from the second support.
Dependencies are inferred from the claim text.