Mounter device, tape removal device, substrate transfer apparatus, tape removal method, and substrate transfer method

A substrate transfer apparatus for transferring a substrate on which a first adhesive tape is applied to a holding surface side to a second adhesive tape, the substrate transfer apparatus comprising:

• a tape application mechanism configured to apply the second adhesive tape to a ring frame and a non-holding surface side of the substrate;
• a tape cutter configured to cut the second adhesive tape along an outer shape of the ring frame;
• a reversal mechanism configured to reverse the substrate adhered and held in the ring frame via the second adhesive tape;
• and
• a tape removal mechanism configured to peel the first adhesive tape from the substrate, wherein
• the tape removal mechanism is configured to cause a peeling angle to differ between a time when peeling starts and a time when peeling ends.

A tape removal method for removing an adhesive tape applied to a substrate, the tape removal method comprising:

• applying a peeling tape to the adhesive tape;
• and
• removing the adhesive tape to which the peeling tape is adhered from the substrate by collecting the peeling tape, wherein
• in the removing the adhesive tape, the adhesive tape is peeled from the substrate in such a manner that a peeling angle is caused to differ between a time when peeling starts and a time when the peeling ends.

A substrate transfer method for transferring a substrate to which a first adhesive tape is applied on a holding surface side to a second adhesive tape, the substrate transfer method comprising:

• applying the second adhesive tape to a ring frame and a non-holding surface side of the substrate;
• cutting the second adhesive tape along an outer shape of the ring frame;
• reversing the substrate adhered and held in the ring frame via the second adhesive tape;
• and
• removing the first adhesive tape, wherein
• in the removing the first adhesive tape, the adhesive tape is peeled from the substrate in such a manner that a peeling angle is caused to differ between a time when peeling starts and a time when the peeling ends.