H10P 72/7446
Using a peeling wheel
Official title: {using a peeling wheel}
H10P72/7446 (Using a peeling wheel) appears on 59 US grants and 74 published applications in this corpus.
Search patents in H10P- Granted patents
- 59
- Published applications
- 74
- Assignees
- 37
- Inventors
- 100
- Latest grant
- 5 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 6 |
| 2003 | 1 | 4 |
| 2004 | 3 | 3 |
| 2005 | 2 | 1 |
| 2006 | 2 | 3 |
| 2007 | 0 | 7 |
| 2008 | 1 | 3 |
| 2009 | 2 | 4 |
| 2010 | 6 | 2 |
| 2011 | 2 | 2 |
| 2012 | 2 | 2 |
| 2013 | 0 | 0 |
| 2014 | 3 | 0 |
| 2015 | 1 | 3 |
| 2016 | 2 | 5 |
| 2017 | 5 | 5 |
| 2018 | 6 | 8 |
| 2019 | 5 | 4 |
| 2020 | 6 | 5 |
| 2021 | 2 | 2 |
| 2022 | 2 | 0 |
| 2023 | 1 | 2 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor packaging apparatus and method of manufacturing semiconductor device using the same5 Mar 2024US 11,923,214 B2Samsung Electronics Co., Ltd.
- Method of demounting thin semiconductor devices22 Aug 2023US 11,735,464 B1American Semiconductor, Inc.
- Diode devices based on superconductivity15 Nov 2022US 11,502,237 B2Psiquantum, Corp.
- Methods for manufacturing a plurality of electronic circuits2 Aug 2022US 11,406,023 B2Pragmatic Printing Ltd.
- Semiconductor device, manufacturing method thereof, and separation apparatus31 Aug 2021US 11,107,846 B2Semiconductor Energy Laboratory Co.Ltd.
- Workpiece holding device2 Jul 2026US 2026/0183971 A1Creative Technology Ltd
- Diode Devices Based on Superconductivity16 Apr 2026US 2026/0107697 A1Psiquantum, Corp.
- Method for producing a die attach adhesive film sheet8 Jan 2026US 2026/0008944 A1Henkel AG & Co. KGaA
- Method for making semiconductor packages24 Aug 2023US 2023/0268315 A1STATS ChipPAC Pte. Ltd.
- Diode Devices Based on Superconductivity6 Jul 2023US 2023/0217841 A1Psiquantum, Corp.
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Method and apparatus for peeling protective adhesive tape from semiconductor wafer63US 5,891,298 ANitto Denko Corporation · 1999
- Diode devices based on superconductivity52US 10,454,014 B2Psiquantum, Corp. · 2019
- Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer43US 7,482,249 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. · 2009
- Fabrication method of semiconductor circuit device40US 7,122,447 B2Renesas Technology Corp. · 2006