Method of demounting thin semiconductor devices

A method of demounting a device wafer, comprising:

• acquiring a device wafer;
• applying a temporary adhesive to the device wafer;
• bonding the device wafer with the temporary adhesive to a carrier substrate;
• thinning the device wafer to produce a thinned device wafer;
• placing the carrier substrate onto a holder;
• rolling an adhesive tape from a roll of adhesive tape onto an exposed surface of the thinned device wafer;
• attaching the adhesive tape to which the thinned device wafer is adhered to a demount roller;
• and
• rotating the demount roller in a first direction to remove the thinned device wafer from the temporary adhesive to the demount roller;
• placing a frame onto the holder;
• and
• rotating the demount roller in a second direction opposite that of the first direction to release the thinned device wafer and the adhesive tape onto a frame.

A method of demounting a device wafer, comprising:

• acquiring a device wafer;
• applying a temporary adhesive to the device wafer;
• bonding the device wafer with the temporary adhesive to a carrier substrate;
• thinning the device wafer to produce a thinned device wafer;
• placing the carrier substrate onto a holder;
• rolling an adhesive tape from a roll of adhesive tape onto an exposed surface of the thinned device wafer;
• attaching the adhesive tape to which the thinned device wafer is adhered to a demount roller;
• and
• rotating the demount roller in a first direction to remove the thinned device wafer from the temporary adhesive to the demount roller;
• providing a second tape;
• rotating the demount roller in a second direction opposite that of the first direction, to transfer the thinned device wafer to the second tape;
• and
• removing the adhesive tape,
• whereby the thinned device wafer is in an inverted orientation.