Semiconductor packaging apparatus and method of manufacturing semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJunghyun Cho, Sang-Geun Park, Dongseok Baek, Jaehyuk Choi
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Abstract
A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
Claims8
A method of manufacturing a semiconductor device, the method comprising:
- forming a bonded substrate by bonding a carrier substrate to a semiconductor substrate in a bonding part of a semiconductor packaging apparatus;
- performing a cooling process that cools the bonded substrate;
- and
- detecting, by a detection part of the semiconductor packaging apparatus, a defect of the bonded substrate during the cooling process,
- wherein detecting the defect of the bonded substrate comprises detecting by the detection part of the semiconductor packaging apparatus, misalignment between the semiconductor substrate and the carrier substrate,
- wherein detecting the misalignment comprises obtaining edge images of an upper surface of the bonded substrate,
- wherein detecting the misalignment by the detection part of the semiconductor packaging apparatus comprises obtaining a degree of the misalignment between the semiconductor substrate and the carrier substrate using the edge images,
- wherein obtaining the degree of the misalignment comprises:
- yielding edge offset values from the edge images, wherein each of the edge offset values corresponds to a respective degree that an edge of the carrier substrate is offset from an edge of the semiconductor substrate.
Dependencies are inferred from the claim text.