Methods for manufacturing a plurality of electronic circuits

A method of manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads, and a respective flexible integrated circuit (IC) comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising:

• providing a flexible first structure comprising the plurality of first portions;
• providing a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs;
• dispensing an adhesive onto the first structure and/or onto the flexible ICs;
• transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on a respective group of contact pads to form an electronic circuit,
• providing a heated surface and an opposing surface together having a gap therebetween,
• transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion,
• wherein a silicone paper layer is located between the electronic circuits and the heated surface to protect the heated surface from fouling with excess adhesive,
• wherein the adhesive forms raised bond pads on at least one flexible IC, wherein each bond pad has a depth between 0.5 μm and 10 μm.