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US 7,482,249 B2Granted
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsAndreas Jakob, Klaus-D. Vissing, Volkmar Stenzel
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Abstract
A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
Claims10
Wafer (1, 2;
- 1b, 2;
- 1c, 2) exhibiting a front side and a rear side, said wafer comprising a carrier layer (4) and an interlayer (3) arranged between a carrier layer (4) and a wafer, characterised in that the interlayer (3) is a plasmapolymeric layer that adheres to the wafer (1, 2;
- 1b, 2;
- 1c, 2) and adheres more firmly to the carrier layer (4) than to the wafer.
1 more element
Dependencies are inferred from the claim text.