Adhesive composition and method of manufacturing a semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorHyungjun Kim
Life of this patent
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Abstract
An adhesive composition comprising a binder resin and a photoinitiator. The binder resin includes a linear or a partially crosslinked copolymer having a plurality of repeating units derived from different acrylate monomers. The copolymer includes a repeating unit having a photoreactive functional group at a side chain and a repeating unit having a siloxane-based functional group at a side chain. The repeating unit has a siloxane-based functional group in a range of about 2% to about 5% of a total weight of the copolymer.
Claims20
An adhesive composition comprising:
- a binder resin and a photoinitiator;
- wherein the binder resin includes a linear or a partially crosslinked copolymer having a plurality of repeating units derived from different acrylate monomers,
- wherein the copolymer includes a repeating unit having a photoreactive functional group at a side chain and a repeating unit having a siloxane-based functional group at a side chain, and
- wherein the repeating unit having a siloxane-based functional group is in a range of about 2% to about 5% of a total weight of the copolymer.
An adhesive composition comprising:
- a binder resin including a linear or partially crosslinked copolymer, the copolymer having a plurality of repeating units derived from different acrylate monomers and at least one repeating unit derived from an acrylic acid monomer,
- wherein the copolymer includes a repeating unit having a photoreactive functional group at a side chain and a repeating unit having a siloxane-based functional group at a side chain, and
- wherein the repeating unit having the siloxane-based functional group is in a range of about 2% to about 5% of a total weight of the copolymer.
A method of manufacturing a semiconductor device comprising:
- attaching a wafer including a plurality of semiconductor chips on an adhesive layer including a binder resin and a photoinitiator;
- sawing the wafer to separate the semiconductor chips from each other;
- and
- peeling the semiconductor chips from the adhesive layer after irradiating the adhesive layer with ultraviolet ray,
- wherein the binder resin includes a linear or a partially crosslinked copolymer having a plurality of repeating units derived from different acrylate monomers,
- wherein the copolymer includes a repeating unit having a photoreactive functional group at a side chain and a repeating unit having a siloxane-based functional group at a side chain, and
- wherein the repeating unit having a siloxane-based functional group is in a range of about 2% to about 5% of a total weight of the copolymer.
Dependencies are inferred from the claim text.