Vehicle, display device and manufacturing method for a semiconductor device

A method of manufacturing a semiconductor device, comprising:

• preparing a first substrate on which a metal layer and a metal oxide layer are formed;
• forming onto the first substrate a layer to be peeled that contains one of a semiconductor element and a light emitting element in which a layer containing an organic compound serves as a light emitting layer so that the layer to be peeled is in contact with the metal oxide layer;
• adhering a second substrate to the layer to be peeled with a first adhesive, and sandwiching the layer to be peeled between the first substrate and the second substrate to which a film is applied;
• separating the layer to be peeled and the first substrate;
• adhering a third substrate to the layer to be peeled with a second adhesive, and sandwiching the layer to be peeled between the second substrate and the third substrate;
• separating the film and the second substrate;
• and
• curving the third substrate,
• wherein the film, the second adhesive and the third substrate serve as a support for the layer to be peeled.

A method for manufacturing a semiconductor device, comprising:

• preparing a first substrate on which a metal layer and a metal oxide layer are formed;
• forming a layer adjacent to a first substrate so that the layer is in contact with the metal oxide layer;
• adhering a second substrate to at least a part of the layer with a first adhesive;
• separating the layer from the first substrate;
• adhering a third substrate to at least a part of the layer with a second adhesive;
• and
• separating the layer from the second substrate by removing the first adhesive,
• wherein the layer comprises a semiconductor element;
• wherein a surface of the third substrate is curved in at least one direction;
• and
• wherein the second adhesive and the third substrate sent as a support for at least the part of the layer.

A method for manufacturing a semiconductor device, comprising the steps of:

• preparing first substrate on which a metal layer and a metal oxide layer are formed;
• forming a layer adjacent to a first substrate so that the layer is in contact with the metal oxide layer;
• adhering a second substrate to at least a part of the layer with a first adhesive;
• separating the layer from the first substrate;
• adhering a third substrate to at least a part of the layer with a second adhesive;
• and
• separating the layer from the second substrate by removing the first adhesive,
• wherein the layer comprises a display element;
• wherein a surface of the third substrate is curved in at least one direction;
• and
• wherein the second adhesive and the third substrate serve as a support for at least the part of the layer.

A method for manufacturing a vehicle comprising a semiconductor device, comprising the steps of:

• forming a layer adjacent to a first substrate;
• adhering a second substrate to at least a part of the layer with a first adhesive;
• separating the layer from the first substrate;
• curving the layer along a curved surface in the vehicle;
• adhering the curved surface in the vehicle to at least a part of the layer after curving the layer;
• and
• separating the layer from the second substrate,
• wherein the layer comprises a semiconductor element,
• wherein the vehicle is selected from the group consisting of an automobile, an aircraft and a train.

A method for manufacturing a vehicle comprising a semiconductor device, comprising the steps of:

• forming a layer adjacent to a first substrate;
• adhering a second substrate to at least a part of the layer with a first adhesive;
• separating the layer from the first substrate;
• curving the layer along a curved surface in the vehicle;
• adhering the curved surface in the vehicle to at least a part of the layer after curving the layer;
• and
• separating the layer from the second substrate,
• wherein the layer comprises a display element,
• wherein the vehicle is selected from the group consisting of an automobile, an aircraft and a train.