H10P 72/743
Used as a support during manufacture of interconnect decals or build up
Official title: {used as a support during manufacture of interconnect decals or build up layers}
H10P72/743 (Used as a support during manufacture of interconnect decals or build up) appears on 2,947 US grants and 3,608 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,947
- Published applications
- 3,608
- Assignees
- 411
- Inventors
- 3,271
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 10 | 0 |
| 1996 | 14 | 0 |
| 1997 | 14 | 0 |
| 1998 | 16 | 0 |
| 1999 | 12 | 0 |
| 2000 | 26 | 0 |
| 2001 | 27 | 11 |
| 2002 | 28 | 37 |
| 2003 | 30 | 46 |
| 2004 | 40 | 50 |
| 2005 | 42 | 56 |
| 2006 | 36 | 34 |
| 2007 | 31 | 30 |
| 2008 | 23 | 38 |
| 2009 | 17 | 57 |
| 2010 | 50 | 44 |
| 2011 | 56 | 53 |
| 2012 | 31 | 39 |
| 2013 | 47 | 28 |
| 2014 | 34 | 30 |
| 2015 | 29 | 47 |
| 2016 | 53 | 94 |
| 2017 | 110 | 151 |
| 2018 | 147 | 172 |
| 2019 | 197 | 301 |
| 2020 | 254 | 362 |
| 2021 | 254 | 384 |
| 2022 | 286 | 338 |
| 2023 | 277 | 348 |
| 2024 | 308 | 424 |
| 2025 | 291 | 304 |
| 2026 | 130 | 130 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Via structure for embedded component and method for making same15 Sep 2026US 12,740,442 B2Intel Corporation
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display apparatus and electronic device25 Aug 2026US 12,720,915 B2Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor package and method for manufacturing the same25 Aug 2026US 12,721,136 B2Samsung Electronics Co., Ltd.
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with integrated chips1 Oct 2026US 2026/0305488 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating interposer, method for fabricating chip, interposer, chip and chip package17 Sep 2026US 2026/0282940 A1Beijing Huafeng Integrated Electronics Co., LTD.
- Semiconductor package and method of manufacturing the semiconductor package27 Aug 2026US 2026/0255967 A1Samsung Electronics Co., Ltd.
- Semiconductor package27 Aug 2026US 2026/0256031 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method924US 6,372,608 B1Seiko Epson Corporation · 2002
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017