Packages with chips comprising inductor-vias and methods forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHao-Cheng Hou, Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Lee, Shang-Yun Hou
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Abstract
A method includes forming an inductor die, which includes forming a metal via over a substrate, forming a magnetic shell encircling the metal via, with the metal via and the magnetic shell collectively forming an inductor, and depositing a dielectric layer around the magnetic shell. The method further includes placing the inductor die over a carrier, encapsulating the inductor die in an encapsulant, forming redistribution lines electrically connecting to the inductor, and bonding a device die to the redistribution lines. The device die is electrically coupled to the inductor through the redistribution lines.
Claims20
A method comprising:
- forming an inductor die comprising:
- forming a metal via over a substrate;
- forming a magnetic shell encircling the metal via, wherein the metal via and the magnetic shell collectively form an inductor;
- and
- depositing a dielectric layer around the magnetic shell;
- placing the inductor die over a carrier;
- encapsulating the inductor die in an encapsulant;
- forming redistribution lines electrically connecting to the inductor;
- and
- bonding a device die to the redistribution lines, wherein the device die is electrically coupled to the inductor through the redistribution lines.
A method comprising:
- forming a first plurality of redistribution lines;
- bonding an inductor die over the first plurality of redistribution lines, wherein the inductor die comprises:
- a first metal via;
- and
- a first magnetic shell encircling the first metal via;
- encapsulating the inductor die in an encapsulant;
- forming a second plurality of redistribution lines over and electrically connected to the inductor die;
- and
- bonding a package component over the second plurality of redistribution lines, wherein the package component is electrically connected to the inductor die through the second plurality of redistribution lines.
A method comprising:
- forming a dielectric layer;
- forming a redistribution line in the dielectric layer;
- bonding an inductor die over the redistribution line, the inductor die comprising an inductor therein, wherein the inductor die comprises:
- a metal via electrically connected to the redistribution line;
- and
- a magnetic shell encircling the metal via;
- molding the inductor die in a molding compound;
- and
- electrically connecting a device die to the inductor.
Dependencies are inferred from the claim text.