Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package comprising:

• a first redistribution wiring layer including a chip mounting region and a peripheral region surrounding the chip mounting region, the first redistribution wiring layer having a plurality of first redistribution wires stacked in at least two layers;
• a first semiconductor device on the chip mounting region of the first redistribution wiring layer;
• a sealing member on the first redistribution wiring layer, the sealing member provided on an upper surface and a side surface of the first semiconductor device;
• a plurality of conductive connectors on the peripheral region of the first redistribution wiring layer, the plurality of conductive connectors penetrating the sealing member and electrically connected to the plurality of first redistribution wires;
• and
• a plurality of heat transfer plugs respectively extending from an upper surface of the sealing member to the upper surface of the first semiconductor device.

A semiconductor package, comprising:

• a first redistribution wiring layer having a chip mounting region and a peripheral region surrounding the chip mounting region;
• a first semiconductor device on the chip mounting region of the first redistribution wiring layer;
• a sealing member on the first redistribution wiring layer, the sealing member provided on an upper surface and a side surface of the first semiconductor device;
• a plurality of conductive connectors on the peripheral region of the first redistribution wiring layer, the plurality of conductive connectors penetrating the sealing member and electrically connected to a plurality of first redistribution wires of the first redistribution wiring layer;
• a plurality of heat transfer plugs respectively extending from an upper surface of the sealing member to the upper surface of the first semiconductor device;
• and
• a heat transfer plate extending in the sealing member on the peripheral region and having a first depth from the upper surface of the sealing member.