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US 2026/0302595 A1Published application
Heterogeneous antenna in fan-out package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Yao Chuang, Po-Hao Tsai, Shin-Puu Jeng
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Abstract
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.
Claims20
A structure comprising:
- an antenna substrate comprising a first antenna component;
- a redistribution structure comprising:
- a plurality of dielectric layers;
- a plurality of redistribution lines in the plurality of dielectric layers;
- and
- a second antenna component, wherein the first antenna component and the second antenna component collectively form parts of an antenna;
- and
- a device die between the antennal substrate and the redistribution structure, wherein the device die is electrically connected to the antenna.
5 more elements
A structure comprising:
- a molding compound;
- a device die in the molding compound;
- a redistribution structure electrically coupled to the device die, wherein the redistribution structure comprises:
- a plurality of dielectric layers;
- and
- a plurality of redistribution lines comprising some portions in the plurality of dielectric layers, wherein the redistribution structure comprises a first part of an antenna;
- and
- an antenna substrate, wherein the device die is located between the antenna substrate and the redistribution structure, and wherein the antenna substrate comprises a second part of the antenna.
5 more elements
A structure comprising:
- a molding compound;
- a device die in the molding compound;
- an antenna substrate comprising:
- a dielectric plate;
- a first metal layer over the dielectric plate;
- and
- a second metal layer under the dielectric plate;
- and
- an antenna comprising:
- a first part in one of the first metal layer and the second metal layer;
- and
- a second part underlying the molding compound, wherein the device die is lower than the first part of the antenna, and higher than the second part of the antenna.
9 more elements
Dependencies are inferred from the claim text.