Via structure for embedded component and method for making same
AssigneeIntel Corporation
InventorsKristof Darmawikarta, Srinivas V. Pietambaram, Haobo Chen
Life of this patent
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Abstract
A via structure for an embedded component and method for making same. The via structure includes a pillar of conductive material perpendicularly attached to a surface of a build-up dielectric layer. The surface and the pillar are conformally covered by a film layer. The film layer is conformally applied and retains a feature landscape profile. A dielectric layer is located on the film layer, the dielectric layer has an upper dielectric surface that is planar. The pillar has a top that is exposed at the upper dielectric surface. The film layer can act as a barrier to cracking because it is selected to have a higher hardness than the material making up the dielectric layer.
Claims25
A structure, comprising:
- a first dielectric layer having a surface;
- a pillar comprising conductive material substantially perpendicular to the surface;
- a second dielectric layer located on the surface and covering sidewalls of the pillar;
- a third dielectric layer located on the second dielectric layer, the third dielectric layer having an upper surface;
- and
- the pillar having a top that is exposed at the upper surface of the third dielectric layer.
A substrate component, comprising:
- a substrate comprising at least one first dielectric layer and an upper surface;
- a bridge component within the substrate;
- a pillar within the substrate, comprising conductive material perpendicularly attached to the bridge component;
- the pillar having sidewalls and a top that is exposed at the upper surface;
- a second dielectric layer between the sidewalls of the pillar and the at least one first dielectric layer, the sidewalls substantially perpendicular to the upper surface;
- and
- an integrated circuit die located on the upper surface, conductively bonded to the top of the pillar.
A multi-chip package (MCP), comprising:
- a substrate comprising a first dielectric layer with an upper dielectric surface;
- a bridge component embedded in the substrate below the upper dielectric surface, the bridge component having a surface with a bridge conductive contact;
- a pillar comprising conductive material perpendicular to the bridge conductive contact, the pillar extending from the surface to the upper dielectric surface, and having a top that is exposed at the upper dielectric surface;
- a second dielectric layer located between the surface and the first dielectric layer, the second dielectric layer covering sidewalls of the pillar;
- and
- an integrated circuit die located on the upper dielectric surface, conductively bonded to the top of the pillar.
A method for making a substrate component, comprising:
- depositing a conductive contact on a first dielectric layer with an upper surface;
- forming a pillar comprising conductive material on the conductive contact, such that the pillar is substantially perpendicular to the upper surface;
- forming a second dielectric layer over the pillar and the upper surface;
- laminating the second dielectric layer with a third dielectric layer;
- and
- planarizing the third dielectric layer to reveal a top of the pillar.
Dependencies are inferred from the claim text.