H10P 72/7424
Used as a support during the manufacture of self-supporting substrates
Official title: {used as a support during the manufacture of self-supporting substrates}
H10P72/7424 (Used as a support during the manufacture of self-supporting substrates) appears on 3,780 US grants and 5,191 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,780
- Published applications
- 5,191
- Assignees
- 480
- Inventors
- 4,291
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 5 |
| 2002 | 9 | 20 |
| 2003 | 6 | 18 |
| 2004 | 17 | 43 |
| 2005 | 25 | 45 |
| 2006 | 23 | 57 |
| 2007 | 35 | 66 |
| 2008 | 30 | 77 |
| 2009 | 40 | 105 |
| 2010 | 82 | 96 |
| 2011 | 96 | 85 |
| 2012 | 74 | 57 |
| 2013 | 71 | 66 |
| 2014 | 57 | 44 |
| 2015 | 67 | 63 |
| 2016 | 87 | 104 |
| 2017 | 114 | 139 |
| 2018 | 137 | 174 |
| 2019 | 216 | 350 |
| 2020 | 304 | 504 |
| 2021 | 339 | 544 |
| 2022 | 405 | 542 |
| 2023 | 422 | 541 |
| 2024 | 436 | 637 |
| 2025 | 431 | 543 |
| 2026 | 203 | 266 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package substrate and fabricating method thereof22 Sep 2026US 12,745,650 B2AaltoSemi Inc.
- Semiconductor package carrier board structure and manufacturing method thereof22 Sep 2026US 12,745,651 B2Phoenix Pioneer Technology Co., Ltd.
- Deformation-resistant interposer for a local silicon interconnect and methods for forming the same15 Sep 2026US 12,740,448 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating package structure1 Sep 2026US 12,727,522 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wiring substrate having multiple build-up parts1 Oct 2026US 2026/0305414 A1Ibiden Co., Ltd.
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Semiconductor package and method of manufacturing the semiconductor package27 Aug 2026US 2026/0255967 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016