Semiconductor package carrier board structure and manufacturing method thereof

A semiconductor package carrier board structure, comprising:

• a plurality of carrier board bodies each including a build-up circuit structure and a plurality of conductive blocks, wherein each of the plurality of carrier board bodies is defined with a first surface and a second surface opposing the first surface, and the plurality of conductive blocks are disposed on peripheral surfaces of at least two opposite sides of the build-up circuit structure and are electrically connected to the build-up circuit structure, wherein the first surface and/or the second surface has a plurality of electrical connection pads for connecting external elements, and a cutting path is defined by an area formed by the plurality of conductive blocks, so that an opening is respectively formed on the first surface of each of the plurality of carrier board bodies corresponding to each of the plurality of conductive blocks;
• and
• a plurality of supporting bumps each erected between two adjacent ones of the openings and overlapping with the cutting path, wherein one end of each of the supporting bumps is combined with a bottom of each of the openings and protrudes from the bottom of each of the openings, and a surface of the other end of each of the supporting bumps is recessed or flush with the first surface of each of the carrier board bodies, and wherein a junction of the bottom and a side wall of each of the openings is a concave arc surface.