H10P 72/7426
Used as a support during build up manufacturing of active devices
Official title: {used as a support during build up manufacturing of active devices}
H10P72/7426 (Used as a support during build up manufacturing of active devices) appears on 693 US grants and 808 published applications in this corpus.
Search patents in H10P- Granted patents
- 693
- Published applications
- 808
- Assignees
- 276
- Inventors
- 1,324
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 2 |
| 2002 | 7 | 12 |
| 2003 | 9 | 13 |
| 2004 | 11 | 17 |
| 2005 | 12 | 14 |
| 2006 | 13 | 23 |
| 2007 | 10 | 20 |
| 2008 | 16 | 24 |
| 2009 | 6 | 17 |
| 2010 | 22 | 28 |
| 2011 | 24 | 32 |
| 2012 | 26 | 39 |
| 2013 | 32 | 36 |
| 2014 | 35 | 34 |
| 2015 | 42 | 41 |
| 2016 | 32 | 46 |
| 2017 | 37 | 46 |
| 2018 | 43 | 38 |
| 2019 | 44 | 31 |
| 2020 | 37 | 43 |
| 2021 | 38 | 50 |
| 2022 | 43 | 49 |
| 2023 | 42 | 63 |
| 2024 | 33 | 45 |
| 2025 | 36 | 21 |
| 2026 | 17 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fine bump pitch die to die tiling incorporating an inverted glass interposer1 Sep 2026US 12,727,490 B2Intel Corporation
- Display apparatus and electronic device25 Aug 2026US 12,720,915 B2Semiconductor Energy Laboratory Co.Ltd.
- Microdevice substrate, display panel, preparation method, and display apparatus11 Aug 2026US 12,707,934 B2Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.
- Transistor structure and methods of forming the same21 Jul 2026US 12,690,398 B2Massachusetts Institute of Technology
- Self-aligning bonding by hydrophilic contrast2 Jun 2026US 12,648,475 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Display device and method of providing the same10 Sep 2026US 2026/0271789 A1Samsung Display Co., Ltd.
- Reconstituted wafer-to-wafer hybrid bonding interconnect architecture with known good dies6 Aug 2026US 2026/0231828 A1Intel Corporation
- Carrier-Assisted Method for Parting Crystalline Material Along Laser Damage Region23 Jul 2026US 2026/0215174 A1Wolfspeed, Inc.
- Methods and apparatus for facilitating manufacture of an integrated circuit on a carrier23 Jul 2026US 2026/0215221 A1Pragmatic Semiconductor Limited
- Method for manufacturing a plurality of electronic semiconductor chips, electronic semiconductor chip and display16 Jul 2026US 2026/0206371 A1ams International AG
Most cited
By later US patents
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Three-dimensional integrated circuit and manufacturing method thereof617US 4,939,568 AFujitsu Limited · 1990
- Single crystal silicon arrayed devices for display panels540US 5,317,236 AKopin Corporation · 1994
- Transferred flexible integrated circuit464US 6,027,958 AKopin Corporation · 2000
- Vehicle, display device and manufacturing method for a semiconductor device423US 7,335,573 B2Semiconductor Energy Laboratory Co.Ltd. · 2008