US 2026/0206371 A1 · METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC SEMICONDUCTOR CHIPS, ELECTRONIC SEMICONDUCTOR CHIP AND DISPLAY

Abstract

A method for manufacturing a plurality of electronic semiconductor chips includes providing an epitaxial semiconductor layer sequence with a plurality of electronic functional regions, the epitaxial semiconductor layer sequence being arranged on or over a substrate, generating a plurality of trenches in the epitaxial semiconductor layer sequence, such that a plurality of epitaxial semiconductor layer stacks are created, depositing absorption layers on or over side faces of the epitaxial semiconductor layer stacks in the trenches, the absorption layers being absorbent for electromagnetic radiation, depositing a further layer on or over first main surfaces of the epitaxial semiconductor layer stacks, the further layer covering the trenches, generating bridging elements connecting the epitaxial semiconductor layer stacks starting from the first main surfaces to a handling wafer, and removing the substrate at least partially. Further, a semiconductor chip and a display are provided.

Claims19

Dependent claims

A method for manufacturing a plurality of electronic semiconductor chips, comprising the steps:

providing an epitaxial semiconductor layer sequence with a plurality of electronic functional regions, the epitaxial semiconductor layer sequence being arranged on or over a substrate,
generating a plurality of trenches in the epitaxial semiconductor layer sequence, such that a plurality of epitaxial semiconductor layer stacks are created, wherein the trenches penetrate the epitaxial semiconductor layer sequence completely such that the substrate is freely accessible,
depositing absorption layers on or over side faces of the epitaxial semiconductor layer stacks in the trenches, the absorption layers being absorbent for electromagnetic radiation,
depositing a further layer on or over first main surfaces of the epitaxial semiconductor layer stacks, the further layer covering the trenches,
generating bridging elements connecting the epitaxial semiconductor layer stacks starting from the first main surfaces to a handling wafer, and
removing the substrate at least partially.

3 more elements

Dependencies are inferred from the claim text.

Method for manufacturing a plurality of electronic semiconductor chips, electronic semiconductor chip and display

Life of this patent

Method for manufacturing a plurality of electronic semiconductor chips, electronic semiconductor chip and display

Life of this patent

Abstract

Claims19