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US 12,727,490 B2Granted
Fine bump pitch die to die tiling incorporating an inverted glass interposer
AssigneeIntel Corporation
InventorsJeremy D. Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Suddhasattwa Nad, Leonel Arana
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Abstract
Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a first layer comprising glass. In an embodiment, conductive pillars are formed through the first layer, and a buildup layer stack is on the first layer. In an embodiment, conductive routing is provided through the buildup layer stack. In an embodiment, a second layer is over a surface of the buildup layer stack opposite from the glass layer.
Claims20
An electronic package, comprising:
- a first layer comprising glass;
- conductive pillars through the first layer, wherein the conductive pillars are continuous from a top of the first layer comprising glass to a bottom of the first layer comprising glass, and wherein each of the conductive pillars has an hourglass shaped cross-section with an uppermost surface at a same level as the top of the first layer, and a bottommost surface at a same level as the bottom of the first layer;
- a buildup layer stack on the first layer, wherein conductive routing is through the buildup layer stack;
- a second layer over a surface of the buildup layer stack opposite from the first layer;
- a hybrid bonding layer coupled to a side of the first layer opposite the buildup layer stack, the hybrid bonding layer comprising conductive pads in contact with the conductive pillars, and the hybrid bonding layer comprising a dielectric layer in contact with the glass of the first layer;
- and
- a plurality of solder balls, wherein individual ones of the plurality of solder balls are provided over corresponding ones of the conductive pillars.
4 more elements
An electronic package, comprising:
- a die, wherein the die comprises:
- a second hybrid bonding layer, the second hybrid bonding layer comprising conductive pads and a dielectric layer;
- and
- a package substrate, wherein the package substrate comprises:
- a first hybrid bonding layer, comprising:
- a third layer comprising glass in contact with the dielectric layer of the second hybrid bonding layer;
- and
- conductive pillars through the third layer, wherein the conductive pillars are continuous from a top of the third layer to a bottom of the third layer, and wherein each of the conductive pillars has an hourglass shaped cross-section with an uppermost surface at a same level as the top of the third layer, and a bottommost surface at a same level as the bottom of the third layer, and wherein the first hybrid bonding layer is coupled to the second hybrid bonding layer, wherein the conductive pillars are in contact with the conductive pads of the second hybrid bonding layer.
5 more elements
A method of forming an electronic package, comprising:
- forming openings through a glass layer;
- attaching the glass layer to a carrier;
- filling the openings with a conductive material to form conductive pillars, wherein the conductive pillars are continuous from a top of the glass layer to a bottom of the glass layer, and wherein each of the conductive pillars has an hourglass shaped cross-section with an uppermost surface at a same level as the top of the glass layer, and a bottommost surface at a same level as the bottom of the glass layer;
- forming a buildup layer stack with conductive routing over the glass layer;
- removing the carrier;
- forming a hybrid bonding layer coupled to a side of the glass layer opposite the buildup layer stack, the hybrid bonding layer comprising conductive pads in contact with the conductive pillars, and the hybrid bonding layer comprising a dielectric layer in contact with the glass layer;
- and
- forming a plurality of solder balls, wherein individual ones of the plurality of solder balls are provided over corresponding ones of the conductive pillars.
5 more elements
An electronic system, comprising:
- a board;
- a package substrate coupled to the board, wherein the package substrate comprises a first hybrid bonding layer with a glass layer and conductive pillars, wherein the conductive pillars are continuous from a top of the glass layer to a bottom of the glass layer, and wherein each of the conductive pillars has an hourglass shaped cross-section with an uppermost surface at a same level as the top of the glass layer, and a bottommost surface at a same level as the bottom of the glass layer;
- and
- a die coupled to the package substrate, wherein the die comprises a second hybrid bonding layer, wherein the first hybrid bonding layer is connected to the second hybrid bonding layer, the second hybrid bonding layer comprising conductive pads in contact with the conductive pillars of the first hybrid bonding layer, and the second hybrid bonding layer comprising a dielectric layer in contact with the glass layer of the first hybrid bonding layer.
1 more element
Dependencies are inferred from the claim text.