H10P 72/7436
Used to support a device or a wafer when forming electrical connections
Official title: {used to support a device or a wafer when forming electrical connections thereto}
H10P72/7436 (Used to support a device or a wafer when forming electrical connections) appears on 1,395 US grants and 1,674 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,395
- Published applications
- 1,674
- Assignees
- 237
- Inventors
- 1,645
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 3 |
| 2005 | 3 | 10 |
| 2006 | 1 | 5 |
| 2007 | 4 | 11 |
| 2008 | 8 | 13 |
| 2009 | 8 | 26 |
| 2010 | 12 | 33 |
| 2011 | 22 | 27 |
| 2012 | 30 | 45 |
| 2013 | 28 | 27 |
| 2014 | 32 | 38 |
| 2015 | 41 | 55 |
| 2016 | 50 | 62 |
| 2017 | 71 | 60 |
| 2018 | 63 | 84 |
| 2019 | 95 | 138 |
| 2020 | 125 | 195 |
| 2021 | 136 | 219 |
| 2022 | 165 | 183 |
| 2023 | 167 | 166 |
| 2024 | 159 | 140 |
| 2025 | 135 | 104 |
| 2026 | 40 | 30 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- Semiconductor package1 Sep 2026US 12,727,476 B2Samsung Electronics Co., Ltd.
- Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package11 Aug 2026US 12,703,044 B2Samsung Electronics Co., Ltd.
- Semiconductor device and manufacturing method thereof4 Aug 2026US 12,702,009 B2nD-HI Technologies Lab, Inc.
- Package structure and method of manufacturing the same4 Aug 2026US 12,702,053 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for bonding semiconductor substrate17 Sep 2026US 2026/0282808 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method for fabricating the same13 Aug 2026US 2026/0239993 A1Samsung Electronics Co., Ltd.
- Glass6 Aug 2026US 2026/0225939 A1AGC Inc.
- Integrated circuit package and method6 Aug 2026US 2026/0231829 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Package with a fan-out structure and method of forming the same579US 8,785,299 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Three dimensional integrated circuit and method of making the same263US 7,385,283 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2008
- Method for fabricating encapsulated semiconductor components235US 6,908,784 B1Micron Technology, Inc. · 2005
- Tri-layer CoWoS structure148US 9,627,365 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017