Apparatus for bonding semiconductor substrate

Abstract

A bonding apparatus includes a chuck table, a gantry frame, a bond head and a deforming mechanism. The chuck table is configured to support a semiconductor wafer. The gantry frame is disposed over the chuck table. The bond head is movably installed on the gantry frame, wherein the bond head is configured to pick up a semiconductor chip from a support, and for moving the semiconductor chip towards the chuck table for bonding to the semiconductor wafer. The deforming mechanism is located below the chuck table, wherein the deforming mechanism is configured to deform the chuck table along with the semiconductor wafer when the semiconductor chip is bonded to the semiconductor wafer.

Dependencies are inferred from the claim text.