H10P 72/7428
Used to support diced chips prior to mounting
Official title: {used to support diced chips prior to mounting}
H10P72/7428 (Used to support diced chips prior to mounting) appears on 877 US grants and 1,151 published applications in this corpus.
Search patents in H10P- Granted patents
- 877
- Published applications
- 1,151
- Assignees
- 332
- Inventors
- 1,863
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 5 |
| 2003 | 5 | 11 |
| 2004 | 5 | 31 |
| 2005 | 15 | 25 |
| 2006 | 14 | 26 |
| 2007 | 21 | 14 |
| 2008 | 14 | 34 |
| 2009 | 7 | 19 |
| 2010 | 18 | 17 |
| 2011 | 22 | 15 |
| 2012 | 13 | 12 |
| 2013 | 14 | 5 |
| 2014 | 10 | 8 |
| 2015 | 12 | 15 |
| 2016 | 19 | 22 |
| 2017 | 22 | 47 |
| 2018 | 35 | 79 |
| 2019 | 63 | 70 |
| 2020 | 75 | 106 |
| 2021 | 84 | 130 |
| 2022 | 97 | 126 |
| 2023 | 79 | 122 |
| 2024 | 87 | 93 |
| 2025 | 92 | 76 |
| 2026 | 31 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Interactive display device and method for manufacturing such a device25 Aug 2026US 12,720,937 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Coupon wafer and method of preparation thereof14 Jul 2026US 12,681,236 B2Rockley Photonics Limited
- Apparatus for fabricating display panel and fabricating method thereof23 Jun 2026US 12,666,922 B2Samsung Display Co., Ltd.
- Coupon wafer and method of preparation thereof26 May 2026US 12,638,637 B2Rockley Photonics Limited
- Film adhesive, dicing/die attach film, semiconductor device, and production method for same24 Sep 2026US 2026/0293603 A1Resonac Corporation
- Film tray semiconductor chip carrier17 Sep 2026US 2026/0282817 A1Arm Limited
- Semiconductor Device Carriers and Methods of Making and Using10 Sep 2026US 2026/0271667 A1UTAC Headquarters Pte. Ltd.
- Method for manufacturing substrate laminate3 Sep 2026US 2026/0262539 A1Mitsui Chemicals, Inc.
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays342US 8,865,489 B2The Board of Trustees of the University of Illinois · 2014
- Chip connection structure having diret through-hole connections through adhesive film and wiring substrate332US 5,870,289 AHitachi, Ltd. · 1999
- Printing semiconductor elements by shear-assisted elastomeric stamp transfer322US 8,506,867 B2Semprius, Inc. · 2013
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014