Coupon wafer and method of preparation thereof
AssigneeRockley Photonics Limited
InventorsLudovic Caro, Guomin Yu
Life of this patent
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Abstract
A coupon wafer for a micro-transfer printing process. The coupon wafer including a device coupon attached to a substrate of the coupon wafer by one or more tethers; wherein the or each tether is a pillar extending at least partially through the device coupon to contact the substrate of the coupon wafer.
Claims17
A coupon wafer for a micro-transfer printing process, the coupon wafer including a device coupon attached to a substrate of the coupon wafer by one or more tethers,
- wherein the or each tether is a pillar extending at least partially through the device coupon to contact the substrate of the coupon wafer,
- wherein the pillar is formed of a liner, which lines a hole which extends through the device coupon, and
- wherein the pillar further includes a filler, which fills the hole.
A method of preparing a coupon wafer for a micro-transfer printing process, the coupon wafer including a device coupon, the method comprising:
- (a) etching a hole through the device coupon and a release layer, so as to expose a region of a substrate of the coupon wafer;
- and
- (b) forming a pillar in the hole, the pillar providing a tether which attaches the device coupon to the substrate,
- wherein the method further includes a step, performed before step (b), of lining the hole with a liner, and wherein step (b) includes depositing a filler into the lined hole to form the pillar.
An optoelectronic device, comprising a device coupon bonded to a cavity of a platform wafer, the cavity being suitable for receiving the device coupon, and the cavity including one or more pillar recesses in a bed thereof for receiving one or more pillars located in the device coupon.
Dependencies are inferred from the claim text.