Chip connection structure having diret through-hole connections through adhesive film and wiring substrate

Chip connection structure including:

• a plurality of chip carriers,
• first adhesive films for stacking said chip carriers,
• first through-holes extending continuously through both said plurality of chip carriers and said first adhesive films, and
• first through-hole conductors which pass through said chip carriers and said first adhesive films, wherein each chip carrier comprises:
• an integrated circuit chip having connecting pads;
• a wiring substrate having first wires which are connected to said first through-hole conductors;
• a second adhesive film for connecting said integrated circuit chip to said wiring substrate by flip chip die bonding;
• second through-holes extending continuously through both said wiring substrate and said second adhesive films;
• and
• second through-hole conductors which pass through said second adhesive film and said wiring substrate and directly connect said connecting pads to said first wires.

Chip connection structure comprising:

• an integrated circuit chip having an integrated circuit and connecting pads;
• a wiring substrate film having wires;
• an adhesive film for connecting said integrated circuit chip to said wiring substrate film by flip chip die bonding;
• through-holes extending continuously through both said wiring substrate film and said adhesive film;
• and
• through-hole conductors extending in said through-holes, which pass through said adhesive film and said wiring substrate film and directly connect said connecting pads to said wires,
• wherein said through-holes have a diameter of less than the size of said connecting pads, and a thickness of said wiring substrate film is less than twice the diameter of the through-holes.