H10P 72/7412
The auxiliary support including means facilitating the separation of a device or
Official title: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
H10P72/7412 (The auxiliary support including means facilitating the separation of a device or) appears on 1,452 US grants and 1,834 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,452
- Published applications
- 1,834
- Assignees
- 479
- Inventors
- 2,747
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 6 |
| 2002 | 9 | 15 |
| 2003 | 13 | 26 |
| 2004 | 17 | 33 |
| 2005 | 22 | 46 |
| 2006 | 16 | 24 |
| 2007 | 32 | 28 |
| 2008 | 25 | 40 |
| 2009 | 19 | 27 |
| 2010 | 22 | 33 |
| 2011 | 25 | 28 |
| 2012 | 28 | 40 |
| 2013 | 32 | 50 |
| 2014 | 39 | 65 |
| 2015 | 64 | 93 |
| 2016 | 85 | 132 |
| 2017 | 102 | 127 |
| 2018 | 111 | 110 |
| 2019 | 123 | 115 |
| 2020 | 107 | 145 |
| 2021 | 115 | 132 |
| 2022 | 97 | 126 |
| 2023 | 84 | 96 |
| 2024 | 77 | 129 |
| 2025 | 88 | 108 |
| 2026 | 55 | 60 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Method of manufacturing laminated assembly29 Sep 2026US 12,751,251 B2Disco Corporation
- Method of manufacturing laminate and kit of adhesive compositions1 Sep 2026US 12,723,176 B2Nissan Chemical Corporation
- Wafer processing method1 Sep 2026US 12,727,436 B2Disco Corporation
- Interactive display device and method for manufacturing such a device25 Aug 2026US 12,720,937 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Laminate, method for manufacturing laminate, and method for manufacturing semiconductor device24 Sep 2026US 2026/0293604 A1Toray Industries, Inc.
- Mounter device, tape removal device, substrate transfer apparatus, tape removal method, and substrate transfer method17 Sep 2026US 2026/0282836 A1Teikoku Taping System Co., Ltd.
- Semiconductor Device Carriers and Methods of Making and Using10 Sep 2026US 2026/0271667 A1UTAC Headquarters Pte. Ltd.
- Manufacturing method of semiconductor device10 Sep 2026US 2026/0271770 A1Alliance Material Co., Ltd.
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
Most cited
By later US patents
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bonding580US 5,821,138 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Method of transferring a thin film to an alternate substrate431US 5,391,257 ARockwell International Corporation · 1995