H10P 72/7414
The auxiliary support including means facilitating the selective separation of some of
Official title: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support}
H10P72/7414 (The auxiliary support including means facilitating the selective separation of some of) appears on 520 US grants and 649 published applications in this corpus.
Search patents in H10P- Granted patents
- 520
- Published applications
- 649
- Assignees
- 238
- Inventors
- 946
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 4 |
| 2002 | 4 | 7 |
| 2003 | 7 | 18 |
| 2004 | 9 | 20 |
| 2005 | 14 | 24 |
| 2006 | 10 | 16 |
| 2007 | 17 | 9 |
| 2008 | 14 | 14 |
| 2009 | 6 | 5 |
| 2010 | 9 | 16 |
| 2011 | 10 | 8 |
| 2012 | 9 | 9 |
| 2013 | 10 | 7 |
| 2014 | 5 | 8 |
| 2015 | 9 | 6 |
| 2016 | 11 | 12 |
| 2017 | 10 | 34 |
| 2018 | 28 | 43 |
| 2019 | 40 | 44 |
| 2020 | 40 | 66 |
| 2021 | 48 | 73 |
| 2022 | 49 | 62 |
| 2023 | 46 | 34 |
| 2024 | 37 | 49 |
| 2025 | 38 | 47 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer processing method1 Sep 2026US 12,727,436 B2Disco Corporation
- Interactive display device and method for manufacturing such a device25 Aug 2026US 12,720,937 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Micro-transfer printing from adhesive surfaces19 May 2026US 12,629,930 B2X-Celeprint Limited
- Semiconductor light-emitting device self-assembly apparatus to solve assembly defect generated during self-assembly19 May 2026US 12,635,310 B2LG Electronics Inc.
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
- Carrier for laser induced forward transfer and transfer apparatus comprising the same13 Aug 2026US 2026/0233341 A1Nexperia B. V.
- Carrier for laser die transfer, wafer assembly, and pick and place apparatus comprising the same6 Aug 2026US 2026/0231730 A1Nexperia B. V.
- Semiconductor structure and package structure23 Jul 2026US 2026/0215288 A1Ennostar Corporation
- Dbi to si bonding for simplified handle wafer2 Jul 2026US 2026/0190893 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Method of transferring a thin film to an alternate substrate431US 5,391,257 ARockwell International Corporation · 1995
- Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays342US 8,865,489 B2The Board of Trustees of the University of Illinois · 2014
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- DBI to Si bonding for simplified handle wafer174US 10,964,664 B2Invensas Bonding Technologies, Inc. · 2021
- Systems and methods for efficient transfer of semiconductor elements171US 10,446,532 B2Invensas Bonding Technologies, Inc. · 2019