Dbi to si bonding for simplified handle wafer
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsChandrasekhar Mandalapu, Gaius Gillman Fountain, Jr., Guilian Gao
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Abstract
Devices and techniques include process steps for preparing various microelectronic components for bonding, such as for direct bonding without adhesive. The processes include providing a first bonding surface on a first surface of the microelectronic components, bonding a handle to the prepared first bonding surface, and processing a second surface of the microelectronic components while the microelectronic components are gripped at the handle. In some embodiments, the processes include removing the handle from the first bonding surface, and directly bonding the microelectronic components at the first bonding surface to other microelectronic components.
Claims21
(canceled)
A method comprising:
- preparing a bonding surface of a first bonding layer on a substrate;
- direct bonding a first singulated die to the bonding surface using a direct non-adhesive technique to form at least a portion of a structure;
- while the substrate supports the first singulated die, forming a second bonding layer over the first singulated die;
- hybrid bonding a second singulated die to the second bonding layer;
- and
- after hybrid bonding the second singulated die to the second bonding layer, removing at least the substrate by grinding or polishing the substrate.
A method comprising:
- direct bonding a first singulated die to a first bonding layer on a substrate using a direct non-adhesive technique to form at least a portion of a structure;
- while the substrate supports the first singulated die, planarizing the first singulated die and providing a second bonding layer over the first singulated die;
- hybrid bonding a second singulated die to the second bonding layer without an adhesive, wherein the second bonding layer on the first singulated die comprises a first conductive feature and the second singulated die comprises a second conductive feature directly bonded to the first conductive feature;
- and
- removing at least the substrate by grinding or polishing the substrate.
Dependencies are inferred from the claim text.