Semiconductor light-emitting device self-assembly apparatus to solve assembly defect generated during self-assembly

A self-assembly apparatus of a semiconductor light emitting diode, the self-assembly apparatus comprising:

• a fluid chamber including a space configured to accommodate a fluid and a plurality of semiconductor light emitting diodes having a magnetic metal;
• a magnet configured to apply a magnetic force to the plurality of semiconductor light emitting diodes in a state where an assembly surface of a board is submerged in the fluid;
• a power supply portion configured to induce an electric field between assembly electrodes provided on the board so that the plurality of semiconductor light emitting diodes become seated at predetermined positions of the board while the plurality of semiconductor light emitting diodes are moved by a change in a position of the magnet;
• and
• a repair portion disposed in the fluid chamber,
• wherein the repair portion comprises a body portion,
• wherein the body portion includes:
• an upper surface disposed to face the assembly surface of the board;
• a lower surface spaced apart from the upper surface;
• and
• a plurality of sidewalls disposed between the upper surface and the lower surface,
• wherein at least one hole is formed in the upper surface,
• wherein the repair portion includes a fluid controller configured to supply the fluid to an inner space of the body portion and suction the fluid in the inner space,
• wherein the repair portion further includes:
• a position adjusting portion configured to move a position of the fluid controller;
• and
• a controller configured to control the position adjusting portion and the fluid controller, and
• wherein the controller is configured to:
• control the position adjusting portion so that the at least one hole overlaps a semiconductor light emitting diode in which an assembly defect has occurred from among the plurality of semiconductor light emitting diodes on the board;
• and
• control the fluid controller so that the fluid is suctioned into the inner space of the body portion in a state where the at least one hole overlaps the semiconductor light emitting diode in which the assembly defect has occurred.