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US 2026/0215288 A1Published application
Semiconductor structure and package structure
AssigneeEnnostar Corporation
InventorsCHANG-TAI HSIAO, CHENG-WEI PENG
Life of this patent
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Abstract
A semiconductor structure includes a first surface, a second surface, a semiconductor portion, and a first penetrating portion. The second surface is opposite to the first surface. The first penetrating portion penetrates the semiconductor portion. The first penetrating portion has a first opening located on the first surface and a second opening located on the second surface. The first penetrating portion allows an ambient medium to penetrate the semiconductor portion through the first opening and the second opening.
Claims20
A semiconductor structure, comprising:
- a first surface;
- a second surface opposite to the first surface;
- a semiconductor portion;
- and
- a first penetrating portion penetrating the semiconductor portion, wherein the penetrating portion is communicated with an ambient medium.
2 more elements
A package structure, comprising:
- a bearing substrate;
- a semiconductor device disposed on the bearing substrate;
- a package layer covering the semiconductor device and the bearing substrate;
- and
- a penetrating portion penetrating the package layer and communicated with an ambient medium.
2 more elements
Dependencies are inferred from the claim text.