Die processing
AssigneeInvensas Bonding Technologies, Inc.
InventorCyprian Emeka Uzoh
Life of this patent
Estimating the term…
Abstract
Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film or surface. Systems include integrated cleaning components arranged to perform multiple cleaning processes simultaneously.
Claims19
A method of forming a microelectronic assembly, comprising:
- providing a protective layer on one or both surfaces of a substrate;
- fixing the substrate onto a carrier;
- singulating the substrate into a quantity of dies fixed to the carrier;
- processing at least a first surface of the dies while the dies are fixed to the carrier;
- cutting the carrier around a perimeter of a first die, the cutting forming a portion of the carrier fixed to a second surface of the first die;
- removing the first die from the quantity of dies while the portion of the carrier is fixed to the second surface of the first die;
- and
- attaching the first die to a prepared surface of a substrate, the first surface of the first die being attached to the prepared surface of the substrate.
A method of forming a microelectronic assembly, comprising:
- depositing a protective coating onto one or both surfaces of a substrate;
- fixing the substrate onto a dicing sheet;
- singulating the substrate into a quantity of singulated elements fixed to the dicing sheet;
- cleaning a first surface of the singulated elements while the singulated elements are fixed to the dicing sheet;
- exposing the singulated elements to ultraviolet radiation;
- stretching the dicing sheet to form or extend gaps between the singulated elements fixed to the dicing sheet;
- cleaning the protective coating from the first surface of the singulated elements while the singulated elements are fixed to the dicing sheet;
- plasma ashing the first surface of the singulated elements while the singulated elements are fixed to the dicing sheet;
- re-cleaning the first surface of the singulated elements while the singulated elements are fixed to the dicing sheet;
- plasma activating the first surface of the singulated elements while the singulated elements are fixed to the dicing sheet;
- cleaning the first surface of the singulated elements again while the singulated elements are fixed to the dicing sheet;
- forming perforations in the dicing sheet along the gaps;
- punching a first singulated element from the dicing sheet along the perforations in the dicing sheet with a vacuum tool, a portion of the dicing sheet fixed to a second surface of the first singulated element and protecting the second surface of the first singulated element from the vacuum tool;
- placing the first singulated element onto a prepared substrate surface;
- attaching the first singulated element to the prepared substrate surface, the first surface of the first singulated element being attached to the prepared substrate surface;
- thermally treating the first singulated element and the prepared substrate surface;
- cleaning the second surface of the first singulated element;
- plasma activating the second surface of the first singulated element;
- punching a second singulated element from the dicing sheet with the vacuum tool, another portion of the dicing sheet fixed to a second surface of the second singulated element and protecting the second surface of the second singulated element from the vacuum tool;
- attaching a first surface of the second singulated element to the second surface of the first singulated element to form a stacked microelectronic arrangement;
- and
- thermally treating the stacked microelectronic arrangement.
Dependencies are inferred from the claim text.