Selective transfer of micro devices
AssigneeVueReal Inc.
InventorGholamreza Chaji
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Abstract
What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.
Claims10
A method of transferring micro devices, the method comprising:
- positioning a donor substrate proximal to a receiver substrate, the donor substrate including the micro devices and the receiver substrate including a bonding layer for creating an electrostatic transfer force for transferring selected micro devices;
- applying a current to the bonding layer to physically morph the bonding layer and create the electrostatic force on the selected micro devices;
- and
- reducing effect of said electrostatic transfer force on unwanted micro devices, the micro devices including the selected micro devices and the unwanted micro devices.
A method of transferring micro devices, comprising:
- positioning a donor substrate comprising micro devices proximal to a receiver substrate, wherein the receiver substrate comprises a current curable bonding layer;
- and
- transferring at least one of the micro devices from the donor substrate to the receiver substrate by applying a current to the current curable bonding layer proximal to the at least one of the micro devices.
Dependencies are inferred from the claim text.