Systems and methods for efficient transfer of semiconductor elements

A method for bonding elements, the method comprising:

• providing a film which supports first plurality of singulated elements, the first plurality of singulated elements disposed adjacent one another along a first surface of the film;
• providing a support structure which supports a second plurality of elements, the second plurality of elements disposed adjacent one another along a second surface of the support structure;
• positioning the film adjacent the support structure such that a selected first element from the first plurality of singulated elements is aligned with and faces a second element from the second plurality of singulated elements;
• applying a force in a direction nonparallel to the first surface of the film to cause the first element to contact the second element;
• directly bonding the first element with the second element;
• and
• removing the first element from the film.

A method for mounting integrated device dies on a support structure, the method comprising:

• receiving a plurality of singulated integrated device dies after a substrate has been singulated to define the plurality of singulated integrated device dies;
• providing a film;
• placing the plurality of singulated integrated device dies to be supported by the film, the plurality of singulated integrated device dies disposed adjacent one another along a surface of the film;
• positioning the film adjacent the support structure such that the surface of the film faces a support surface of the support structure;
• selecting a first known good die from the plurality of singulated integrated device dies, the first known good die having properly-functioning electrical characteristics;
• selectively positioning the film laterally relative to the support structure such that the first known good die is aligned with a first location of the support structure;
• applying a force in a direction nonparallel to the surface of the film to cause the selected first known good die to be directly transferred from the film to the support structure, such that the first known good die is removed from the film.

A method for mounting a plurality of elements on a support structure, the method comprising:

• receiving a plurality of singulated elements;
• providing a film;
• placing the plurality of singulated elements to be supported by the film, the plurality of singulated elements disposed adjacent one another along a surface of the film;
• positioning the film adjacent the support structure such that the surface of the film faces a support surface of the support structure;
• selectively positioning the film laterally relative to the support structure such that a selected first element is aligned with a first location of the support structure;
• and
• applying a force in a direction nonparallel to the surface of the film to cause a selected first element to be directly transferred from the film to the support structure, such that the first element is removed from the film and directly bonded to the support structure without an intervening adhesive.