H10P 72/7416
Used during dicing or grinding
Official title: {used during dicing or grinding}
H10P72/7416 (Used during dicing or grinding) appears on 4,923 US grants and 6,324 published applications in this corpus.
Search patents in H10P- Granted patents
- 4,923
- Published applications
- 6,324
- Assignees
- 810
- Inventors
- 7,047
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 2 | 0 |
| 1990 | 7 | 0 |
| 1991 | 3 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 14 | 0 |
| 1999 | 24 | 0 |
| 2000 | 23 | 0 |
| 2001 | 26 | 27 |
| 2002 | 48 | 71 |
| 2003 | 58 | 75 |
| 2004 | 63 | 92 |
| 2005 | 72 | 132 |
| 2006 | 68 | 127 |
| 2007 | 66 | 117 |
| 2008 | 63 | 127 |
| 2009 | 83 | 110 |
| 2010 | 101 | 145 |
| 2011 | 114 | 174 |
| 2012 | 132 | 254 |
| 2013 | 166 | 246 |
| 2014 | 196 | 271 |
| 2015 | 277 | 317 |
| 2016 | 282 | 370 |
| 2017 | 343 | 350 |
| 2018 | 296 | 337 |
| 2019 | 298 | 351 |
| 2020 | 345 | 414 |
| 2021 | 328 | 415 |
| 2022 | 306 | 392 |
| 2023 | 303 | 427 |
| 2024 | 296 | 400 |
| 2025 | 284 | 336 |
| 2026 | 170 | 247 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing device, wafer mounting device, dicing device, and semiconductor manufacturing method6 Oct 2026US 12,757,685 B2Mitsubishi Electric Corporation
- Semiconductor structure and manufacturing method thereof8 Sep 2026US 12,733,534 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating package structure1 Sep 2026US 12,727,522 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip bonding system and chip bonding method25 Aug 2026US 12,721,104 B2Bondtech Co., Ltd.
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Plasma diced wafers and methods thereof8 Oct 2026US 2026/0314321 A1UTAC Headquarters Pte. Ltd.
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
- Method for dicing semiconductor wafer and method for manufacturing semiconductor device1 Oct 2026US 2026/0305215 A1Resonac Corporation
- Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device1 Oct 2026US 2026/0305252 A1Resonac Corporation
- Semiconductor structure and manufacturing method thereof1 Oct 2026US 2026/0305449 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Embedded wafer-level bonding approaches616US 8,361,842 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013