Semiconductor structure and manufacturing method thereof

A semiconductor structure, comprising:

• a circuit structure;
• at least one first semiconductor die, disposed over and electrically connected to the circuit structure in a device region of the semiconductor structure;
• a plurality of supporting structures, disposed over the circuit structure in a peripheral region of the semiconductor structure, wherein the plurality of supporting structures are arranged in a manner of point symmetry in respect to a center of the semiconductor structure, wherein the plurality of supporting structures comprise a plurality of deep trench capacitors, wherein the plurality of deep trench capacitors are electrically connected to the circuit structure;
• and
• an insulating encapsulation, disposed over the circuit structure and encapsulating the at least one first semiconductor die and the plurality of supporting structures.

A method of manufacturing a semiconductor structure, comprising:

• providing at least one first semiconductor die in a device region of the semiconductor structure;
• providing at least one first supporting structure in a peripheral region of the semiconductor structure, the peripheral region surrounding the device region;
• laterally encapsulating the at least one first semiconductor die and the at least one first supporting structure in an encapsulant, wherein a thickness of the encapsulant at an edge of the semiconductor structure is less than a thickness of the encapsulant within the device region of the semiconductor structure;
• forming a circuit structure over the at least one first semiconductor die and the at least one first supporting structure encapsulated in the encapsulant, the circuit structure electrically connecting the at least one first semiconductor die, and a sidewall of the encapsulant being flush with a sidewall of the circuit structure;
• disposing a redistribution circuit structure over the circuit structure, the redistribution circuit structure being electrically connected to the circuit structure, wherein the circuit structure is between the encapsulant and the redistribution circuit structure;
• and
• disposing a plurality of conductive terminals on the redistribution circuit structure, the plurality of conductive terminals being connected to the redistribution circuit structure, wherein the redistribution circuit structure is between the plurality of conductive terminals and the circuit structure.