H10P 72/742
Involving stretching of the auxiliary support post dicing
Official title: {involving stretching of the auxiliary support post dicing}
H10P72/742 (Involving stretching of the auxiliary support post dicing) appears on 435 US grants and 558 published applications in this corpus.
Search patents in H10P- Granted patents
- 435
- Published applications
- 558
- Assignees
- 143
- Inventors
- 847
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 2 |
| 2002 | 2 | 4 |
| 2003 | 3 | 2 |
| 2004 | 2 | 4 |
| 2005 | 5 | 11 |
| 2006 | 4 | 14 |
| 2007 | 4 | 12 |
| 2008 | 3 | 19 |
| 2009 | 10 | 13 |
| 2010 | 16 | 27 |
| 2011 | 18 | 21 |
| 2012 | 20 | 29 |
| 2013 | 20 | 32 |
| 2014 | 12 | 24 |
| 2015 | 23 | 27 |
| 2016 | 30 | 44 |
| 2017 | 30 | 21 |
| 2018 | 22 | 29 |
| 2019 | 34 | 44 |
| 2020 | 34 | 39 |
| 2021 | 29 | 45 |
| 2022 | 30 | 24 |
| 2023 | 19 | 26 |
| 2024 | 19 | 21 |
| 2025 | 20 | 16 |
| 2026 | 12 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Processing method of workpiece19 May 2026US 12,629,779 B2Disco Corporation
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- Die bonding apparatus and manufacturing method for semiconductor device24 Mar 2026US 12,588,457 B2Fasford Technology Co., Ltd.
- Method of processing plate-shaped workpiece17 Mar 2026US 12,576,462 B2Disco Corporation
- Method of manufacturing multilayer device16 Jul 2026US 2026/0206515 A1Tazmo Co., Ltd.
- Dicing/die-bonding integrated film and method for manufacturing the same2 Jul 2026US 2026/0190945 A1Resonac Corporation
- Die processing28 May 2026US 2026/0150611 A1Adeia Semiconductor Bonding Technologies Inc.
- Coated semiconductor dies21 May 2026US 2026/0144132 A1Texas Instruments Incorporated
- Laser ablation for die separation to reduce laser splash and electronic device30 Apr 2026US 2026/0123446 A1
Most cited
By later US patents
- Method of reducing residual contamination in singulated semiconductor die237US 10,026,605 B2Semiconductor Components Industries, LLC · 2018
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer182US 8,129,258 B2Xerox Corporation · 2012
- Die processing162US 10,985,133 B2Invensas Bonding Technologies, Inc. · 2021
- Substrate dividing method138US 7,566,635 B2Hamamatsu Photonics K.K. · 2009