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US 2026/0190945 A1Published application
Dicing/die-bonding integrated film and method for manufacturing the same
AssigneeResonac Corporation
InventorsKeisuke OHKUBO, Satoshi YABUSHITA, Naohiro KIMURA, Tetsuya TANIGUCHI, Yukihiro IWANAGA, Miharu KOSHINO
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Abstract
A dicing/die-bonding integrated film 10 including a dicing film 5 including a substrate film 3 and a pressure-sensitive adhesive layer 2 provided on the substrate film 3, and a bonding adhesive layer composed of a die-bonding film 1 disposed on the pressure-sensitive adhesive layer 2 of the dicing film 5. The loss tangent of the dicing film 5 at 0° C. is 0.15 or less.
Claims18
A dicing/die-bonding integrated film comprising:
- a dicing film including a substrate film and a pressure-sensitive adhesive layer provided on the substrate film;
- and
- a bonding adhesive layer composed of a die-bonding film and disposed on the pressure-sensitive adhesive layer of the dicing film,
- wherein a loss tangent at 0° C. of the dicing film is 0.15 or less, and
- wherein the loss tangent is a value determined by a method including:
- preparing a measurement sample of the dicing film having a rectangular principal surface with a short side of 5 mm and a long side of 8 mm;
- fixing, in a viscoelasticity measuring device (Rheogel-E4000, manufactured by UBM Co., Ltd.) including a solid shearing jig having a first plate-shaped member and a pair of second plate-shaped members, the measurement sample to the solid shearing jig by disposing two of the measurement samples in a direction in which the principal surface of the pressure-sensitive adhesive layer is in contact with the first plate-shaped member and the first plate-shaped member is sandwiched between the two measurement samples to clamp the measurement sample in a thickness direction under a condition that the clamping pressure applied by each of the pair of second plate-shaped members is a torque wrench 9 cN·m;
- and
- determining the loss tangent by dynamic viscoelasticity measurement in a shear mode using the solid shearing jig to which the measurement sample is fixed under the conditions that a measurement frequency is 10 Hz, a strain amount is 1% in terms of the total thickness ratio of the dicing film, and a temperature raising rate is 2° C./min.
6 more elements
A method for manufacturing a dicing/die-bonding integrated film, the method comprising:
- selecting a dicing film including a substrate film and a pressure-sensitive adhesive layer provided on the substrate film, the dicing film having a loss tangent at 0° C. of 0.15 or less;
- and
- bonding a die-bonding film and the pressure-sensitive adhesive layer of the dicing film,
- wherein the loss tangent is a value determined by:
- preparing a measurement sample of the dicing film having a rectangular principal surface with a short side of 5 mm and a long side of 8 mm;
- fixing, in a viscoelasticity measuring device (Rheogel-E4000, manufactured by UBM Co., Ltd.) including a solid shearing jig having a first plate-shaped member and a pair of second plate-shaped members, the measurement sample to the solid shearing jig by disposing two of the measurement samples in a direction in which the principal surface of the pressure-sensitive adhesive layer is in contact with the first plate-shaped member and the first plate-shaped member is sandwiched between the two measurement samples to clamp the measurement sample in a thickness direction under a condition that the clamping pressure applied by each of the pair of second plate-shaped members is a torque wrench 9 cN·m, and
- determining the loss tangent by dynamic viscoelasticity measurement in a shear mode using the solid shearing jig to which the measurement sample is fixed under the conditions that a measurement frequency is 10 Hz, a strain amount is 1% in terms of a total thickness ratio of the dicing film, and a temperature raising rate is 2° C./min.
4 more elements
Dependencies are inferred from the claim text.