Laser ablation for die separation to reduce laser splash and electronic device
OwnerMichael Todd Wyant, Joseph O. Liu +1inventors
InventorsMichael Todd Wyant, Joseph O. Liu, Christopher Daniel Manack
Life of this patent
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Abstract
A method includes performing a laser ablation process that removes a portion of a wafer to form a trench in a scribe region between adjacent die regions of the wafer, the trench extending from a first side of the wafer toward an opposite second side of the wafer, the trench extending through a metallization structure and an active circuit portion of the wafer, and a bottom of the trench spaced apart from the second side of the wafer. The method also includes performing a wafer expansion process that separates individual semiconductor dies from the wafer after the laser ablation process.
Claims20
An electronic device, comprising:
- a semiconductor die having opposite first and second sides, a third side, an active circuit portion, a metallization structure, and a conductive feature, the conductive feature on the first side, the third side extends between the first and second sides, the metallization structure between the first side and the active circuit portion, the active circuit portion between the metallization structure and the second side, and the active circuit portion spaced apart from the second side;
- a conductive lead electrically connected to the conductive feature of the semiconductor die;
- a package structure that encloses a portion of the semiconductor die and exposes a portion of the conductive lead;
- and
- a mark on the third side of the semiconductor die, the mark extending from the first side toward the second side, the mark extending along the metallization structure and the active circuit portion, and the mark spaced apart from the second side.
An electronic device, comprising:
- a semiconductor die having opposite first and second sides, a third side, an active circuit portion, a metallization structure, the third side extends between the first and second sides, the metallization structure between the first side and the active circuit portion, the active circuit portion between the metallization structure and the second side, and the active circuit portion spaced apart from the second side;
- a conductive lead electrically connected to a conductive feature of the semiconductor die;
- a package structure that encloses a portion of the semiconductor die and exposes a portion of the conductive lead;
- and
- a mark on the third side of the semiconductor die, the mark extending from the first side toward the second side, the mark extending along the metallization structure and the active circuit portion, and the mark spaced apart from the second side.
An electronic device, comprising:
- a semiconductor die having opposite first and second sides, a third side, and an active circuit portion;
- a conductive lead electrically connected to a conductive feature of the semiconductor die;
- a package structure that encloses a portion of the semiconductor die and exposes a portion of the conductive lead;
- and
- a mark on the third side of the semiconductor die, the mark extending from the first side toward the second side, the mark extending along the metallization structure and the active circuit portion, and the mark spaced apart from the second side.
Dependencies are inferred from the claim text.