Substrate dividing method

A method of manufacturing a semiconductor device formed using a substrate dividing method, the manufacturing method comprising:

• irradiating a substrate, the substrate comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while positioning a light -converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from a laser light incident face of the substrate;
• placing a protective film over a front face of the substrate after the step of forming the starting point region for cutting;
• grinding a rear face of the substrate after the step of placing the protective film such that the substrate attains a predetermined thickness, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut;
• attaching an expansion film to rear faces of the chips after the step of dividing the substrate into the chips;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to separate the chips from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the substrate that is separate from the other cut portions of the substrate.

A method of manufacturing a semiconductor device formed using a substrate dividing method, the manufacturing method comprising:

• irradiating a substrate, the substrate comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while positioning a light -converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from a laser light incident face of the substrate;
• placing a protective film over a front face of the substrate after the step of forming the starting point region for cutting;
• grinding a rear face of the substrate after the step of placing the protective film such that the substrate attains a predetermined thickness;
• attaching an expansion film to the rear face of the substrate after the step of grinding the rear face of the substrate;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut and separate the chips from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the substrate that is separate from the other cut portions of the substrate.

A substrate dividing method comprising the steps of:

• irradiating a substrate with laser light while positioning a light-converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from a laser light incident face of the substrate;
• placing a protective film over a front face of the substrate after the step of forming the starting point region for cutting;
• grinding a rear face of the substrate after the step of placing the protective film such that the substrate attains a predetermined thickness;
• attaching an expansion film to the rear face of the substrate after the step of grinding the rear face of the substrate;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut and separate the chips from each other.

A substrate dividing method comprising the steps of:

• irradiating a rear face of a substrate, the substrate having a front face over which a protective film is placed, with laser light while positioning a light-converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from the rear face of the substrate;
• grinding the rear face of the substrate after the step of forming the starting point region for cutting such that the substrate attains a predetermined thickness, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut;
• attaching an expansion film to rear faces of the chips after the step of dividing the substrate into the chips;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to separate the chips from each other.

A method of manufacturing a semiconductor device formed using a substrate dividing method, the manufacturing method comprising:

• irradiating a rear face of a substrate, the substrate comprising semiconductor material and having a front face which is formed with at least one semiconductor device and over which a protective film is placed, with laser light while positioning a light-converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from the rear of the substrate;
• grinding the rear face of the substrate after the step of forming the starting point region for cutting such that the substrate attains a predetermined thickness, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut;
• attaching an expansion film to rear faces of the chips after the steps of dividing the substrate into the chips;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to separate the chips from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the substrate that is separate from the other cut portions of the substrate.

A method of manufacturing a semiconductor device formed using a substrate dividing method, the manufacturing method comprising:

• irradiating a rear face of a substrate, the substrate comprising semiconductor material and having a front face which is formed with at least one semiconductor device and over which a protective film is placed, with laser light while positioning a light-converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from the rear face of the substrate;
• grinding the rear face of the substrate after the step of forming the starting point region for cutting such that the substrate attains a predetermined thickness;
• attaching an expansion film to the rear face of the substrate after the step of grinding the rear face of the substrate;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut and separate the chips from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the substrate that is separate from the other cut portions of the substrate.

A substrate dividing method comprising the steps of:

• irradiating a rear face of a substrate, the substrate having a front face over which a protective film is placed, with laser light while positioning a light-converging point within the substrate, so as to form a modified region within the substrate, and causing the modified region to form a starting point region for cutting along a line along which the substrate should be cut, in the substrate inside by a predetermined distance from the rear face of the substrate;
• grinding the rear face of the substrate after the step of forming the starting point region for cutting such that the substrate attains a predetermined thickness;
• attaching an expansion film to the rear face of the substrate after the step of grinding the rear face of the substrate;
• and
• expanding the expansion film after the step of attaching the expansion film, so as to divide the substrate into a plurality of chips along the line along which the substrate should be cut and separate the chips from each other.