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US 10,985,133 B2Granted
Die processing
AssigneeInvensas Bonding Technologies, Inc.
InventorCyprian Emeka Uzoh
Life of this patent
Estimating the term…
Abstract
Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film or surface. Systems include integrated cleaning components arranged to perform multiple cleaning processes simultaneously.
Claims18
A method comprising:
- applying, to a substrate including a wafer, a protective layer to a bonding surface of the wafer;
- singulating the wafer and the protective layer into a plurality of semiconductor die components;
- and
- removing the protective layer to expose an individual bonding surface of one or more semiconductor die components of the plurality of semiconductor die components.
1 more element
A method comprising:
- applying, to a substrate including a wafer, a protective layer to a bonding surface of the wafer, the substrate being coupled to a carrier;
- singulating the wafer and the protective layer into a plurality of semiconductor die components;
- stretching the carrier to form gaps between one or more semiconductor die components of the plurality of semiconductor die components fixed to the carrier;
- and
- after stretching the carrier, removing the protective layer to expose an individual bonding surface of the one or more semiconductor die components of the plurality of semiconductor die components.
2 more elements
Dependencies are inferred from the claim text.